New SMT Equipment: deposit (Page 1 of 8)

CHAMPION 6809 - Digital Deposition System.

CHAMPION 6809 - Digital Deposition System.

New Equipment |  

Unparalleled Dispensing Accuracy The CHAMPION 6809 is a servo driven, automatic dispensing system designed for precision processes. The system can be configured to match exacting application requirements from dots to under fill with a broad array of

Creative Automation Company

Stencils

New Equipment |  

Solder paste deposition

Tannlin Ltd

Intro to Atomic Layer Deposition

New Equipment |  

Next Scheduled Public Courses: May 1-2, 2008 ~ Dallas, TX July 16-17, 2008 ~ San Francisco, CA At SEMICON West October 23-24, 2008 ~ San Jose, CA November 6-7, 2008 ~ Dallas, TX This course is designed to provide the student basics of Atomic La

PTI Seminars, Inc.

Copper Foils

Copper Foils

New Equipment |  

Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and

Oak Mitsui Inc.

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

Laser Cut Stencils

New Equipment |  

Stencils, metal mask tools used for the deposit of solder paste onto PC Board before component placement. Please call for the best process for your requirements.

I-Source Technical Services, Inc.

Hybrid Stencils

New Equipment |  

Stencils, metal mask tools used for the deposit of solder paste onto PC Board before component placement. Please call for the best process for your requirements.

I-Source Technical Services, Inc.

Epoxy Stencils

New Equipment |  

Stencils, metal mask tools used for the deposit of epoxy onto PC Board before component placement. Please call for the best process for your requirements.

I-Source Technical Services, Inc.

BGA Rework & Micro BGA Rework Stencils

New Equipment |  

Stencils, metal mask tools used for the deposit of solder paste or preformed solder balls onto BGA substrate. Please call for the best process for your requirements.

I-Source Technical Services, Inc.

Stencils

New Equipment |  

Quality stencils for coarse and fine pitch solder and epoxy deposition. Cost and quality competitive against laser cut stencils. Twenty-four turn, no premium!

Hybrid Screen Technologies, Inc.

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