1) 4 layers board, 1.2mm thickness 2) Min. track width: 0.13mm 3) Min. track space: 0.12mm 4) Min. hole size: 0.3mm 5) Finish: immersion gold
1. Aluminum backed 2. Single sided 3. Thermal conductivity: 2.0W/MK 4. White solder mask/ no text 5. 1 OZ copper finished 6. 1.0mm finished thickness 7. Immersion gold 8. Hexagonal shape, punch profile
FR-4 Material 2. 4 mm Thickness 3OZ base Cu 10 Layers Immersion Gold Surface Treatment Green Solder Mask
Material: FR4 Layer Coverage: 12L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green
FR-4 Material 1.6 mm Thickness 12 Layers Immersion Gold Surface Treatment 0.2mm Drill Green Solder Mask Color BGA, Impedance Control
Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold
Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold
1) Single Sided PCB 2) Material ranges: FR-1, 94VO/HB, 22nf, CEM-1 and CEM-3, FR-4 3) Copper weight: 1-2 oz 4) Profile: Punch 5) Thickness: 0.8mm-1.6mm 6) Surface finish: OSP, HASL, Immersion Gold
1. Bergquist metal backed 2. 1.6mm thick, single sided, 1oz 3. Black solder mask 4. CNC rout outline 5. immersion gold 6. Applications: LED prodcuts, High power supply, Computers etc
1. Thermagon metal backed 2. 1.6mm thick, single sided, 1 oz 3. Black solder mask 4. CNC rout outline 5. immersion gold 6. Applications: High power supply, Computers, Industrial power equipment, LED
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