New SMT Equipment: dice (Page 2 of 3)

Quik-Pak, a division of GEL-PAK

New Equipment |  

Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing

Quik-Pak

BioTech Services Division

BioTech Services Division

New Equipment |  

Our Bio-Tech Services division provides processes on a contract basis to companies engaged in the design and manufacture of various types of microfluidic devices. Our typical client is an R&D group looking for fast turn micro fabrication services fo

American Precision Dicing, Inc.

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

3M Wafer Support System

3M Wafer Support System

New Equipment | Other

The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bonding agent

Syagrus Systems

NEPTCO, Inc.

New Equipment |  

NEPTCO�s WAFERTAPE family of products for wafer mounting, dicing and backgrinding is designed to insure consistent, precise, and repeatable wafer production yields. NEPTCO's superior coating technology encompasses Total Thickness Variation (TTV) co

NEPTCO, Inc.

Quik-Pak, a division of GEL-PAK

Quik-Pak, a division of GEL-PAK

New Equipment |  

Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing

Quik-Pak

IC Packaging

IC Packaging

New Equipment |  

PROMEX INDUSTRIES now fills the need for on shore integrated circuit assembly and packaging foundry services for small lots and prototypes through medium volume production. We are committed to providing high quality, quick turnaround semiconductor

Promex Industries, Inc.

Porous Ceramic Chuck Table

Porous Ceramic Chuck Table

New Equipment | Components

Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, good porosity, durable absorption, excellent quali

Werlchem LLC

Wafer and Die Visual Inspection

Wafer and Die Visual Inspection

New Equipment | Inspection

Syagrus Systems has a long history in providing superior wafer and die visual inspection services to the semiconductor industry.  Syagrus Systems features fully automated wafer inspection systems as well as the flexibility of manual wafer inspection

Syagrus Systems


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