Dispensing Equipment for Small Batches and Rework Micro dispensing for small batches and rework. Precisely dispense solder paste, epoxy and underfill with the highest consistency, even for the smallest dots. For 25 years MARTIN have been setting
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
6 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
The CHAMPION 8300 is a servo driven, high-throughput, automatic dispensing system designed for in-line conveyorized processes. The system can be configured to match exacting application requirements from dots to underfill with a broad array of option
Epibond� 7275-Series surface mount adhesives offer excellent performance for all print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non st
Stinger is a low volume dispense module attached to the camera carriage of a standard DEK printer (as an optional extra). It is not designed to replace a regular dispenser but to provide dual functionality to the print platform for customers who requ
0.15mm diameter). Adhesives Highest precision, even for delicate conductive adhesives with relatively large particles. Trouble free precision processing of abrasive media. Dispenser head heating prevents ‘stringing’. Potting Compou
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
High speed, precision dispensing by digital and cam drives. High speed, precision dispensing: 0.08 sec./dot saves floor space due to compact design. Glue is charged with compressed air at a high speed and the advanced cam-link head mechanism is abl
