New SMT Equipment: ecd mole heller (Page 1 of 3)

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

Voidless / Vacuum Reflow Soldering Oven - 1809 MK5

New Equipment | Reflow

1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C

Heller Industries Inc.

SMT 回流焊炉-MK5 系列

SMT 回流焊炉-MK5 系列

New Equipment | Reflow

适用于大尺寸PCB板及双轨道生产的世界一流的SMT 回流焊炉 随着最新的技术突破,HELLER推出了全新的MARK 5回流焊系列,为客户提供了更为经济的方案。新型的加热和冷却技术能最大限度 地减少氮气和电力消耗,省氮省电高达40%。因此,MK5系列不仅性能卓越,更是业界最具经济价值的回流焊系列产品。 选择适合您制程需求的回流焊设备 1826MK5 回流焊炉 - 这些马力为高容量要求提供了稳定的性能,同时大大减少预防性保养的时间及空间占地。 1936MK5/2043MK5 回流焊炉 -

Heller 公司

1809 MK5 - Heller 고급 인라인 무보이드 / 진공 리플로우 솔더링 오븐

1809 MK5 - Heller 고급 인라인 무보이드 / 진공 리플로우 솔더링 오븐

New Equipment | Reflow

9개 존을 갖춘 무보이드 진공 리플로우 솔더링 오븐. 균형적 흐름 기술이 있는 무보이드 / 진공 리플로우 솔더링 질소 시스템 9개의 탑 및 바텀 가열 존 - 업계 최고의 직선형 피트당 최고의 존 수! 100인치 가열 길이 - 고처리율 제공! 2개의 내부 냉각 존 - 최저 출구 온도 제공! 총 길이 180인치 - 바닥면적 활용 최적화! 10인치 모듈의 새로운 모듈 디자인이 프로파일을 보다 작은 세그먼트로 세분화할 수 있는 유연성을

Heller Korea Ltd.

대량 생산을 위한 컨벡션 리플로우 오븐.  - 1826 Mark 5

대량 생산을 위한 컨벡션 리플로우 오븐. - 1826 Mark 5

New Equipment | Reflow

세계 최고의 컨벡션 리플로우 오븐 대량의 요구에도 일관된 성능을 제공하는 동시에, 예방적 유지관리와 바닥면적은 최소화합니다 무납 인증! 유지관리 불필요! 최저의 질소 & 전기 사용! 무료로 제공되는 통합 Cpk 소프트웨어! 최근 Mark 5 리플로우 시스템 관련 혁신이 이뤄져, 보다 더 낮은 소유비용으로 제공됩니다. Heller의 새로운 가열 및 냉각 접근 방식은 최대 40%까지의 질소 및 전기 소비 절감을 제공합니다.

Heller Korea Ltd.

M.O.L.E.® MAP Thermal Profiler Software

M.O.L.E.® MAP Thermal Profiler Software

New Equipment | Software

M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E

Electronic Controls Design Inc. (ECD)

M.O.L.E.® Reflow Oven Thermal Profilers

M.O.L.E.® Reflow Oven Thermal Profilers

New Equipment | Reflow

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

OvenCHECKER™ Reflow Oven Verification Tool

OvenCHECKER™ Reflow Oven Verification Tool

New Equipment | Reflow

Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr

Electronic Controls Design Inc. (ECD)

SuperM.O.L.E.® Gold 2  Flux and Wave Solder Thermal Profilers

SuperM.O.L.E.® Gold 2 Flux and Wave Solder Thermal Profilers

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

Heller 2043 MK5 Lead Free Reflow Oven

Heller 2043 MK5 Lead Free Reflow Oven

New Equipment | Reflow

Like new condition Heller 2043 MK Lead Free Reflow Oven.  See several images and facilities drawings in the link. 2043MK5: Ultra Low Power Consumption Convection dryer Oven original price at $122,776.00 1.100% Forced Convection Reflow Oven with the

Xsys Engineering inc

MEGAM.O.L.E.® 20 Channel Thermal Profiler

MEGAM.O.L.E.® 20 Channel Thermal Profiler

New Equipment | Reflow

Do you demand the highest density of thermocouples placement possible on your Hi-Reliability, High-Value PCB? ECD's got your Spec! Do you expect a software package that flexes with your workflow, providing customizable data extractions, Imports of yo

Electronic Controls Design Inc. (ECD)

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