New SMT Equipment: eliminates (Page 3 of 27)

F8200 Series

New Equipment |  

Filter units with airflows up to 2000 cfm to filter and recirculate process exhaust from wave solder units, reflow ovens, etc. Provides excellent flexibility and eliminates venting to the outside.

Impell Purification Technologies

Reflow Pallets

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Reflow pallets hold board rigid and have flush hold downs. This allows for better stenciling and eliminates handling problems since pallet can go all the way through the SMT process.

Garland Service ( GSC )

Workstation and Personnel Grounding Products

New Equipment |  

Complete line of products for use in reducing or eliminating harmful static electricity at your workstations and on your personnel.

Static Control Components, Inc.

USB / IEEE 1394

New Equipment |  

Custom-designed USB and IEEE 1394 devices incorporated into the Device Bay standard for uniformity and perpetual product life. Port your ISA and PCI devices to Device Bay technology to avoid disaster when ISA and PCI are eliminated in the PC marketp

Granite Microsystems

Paste Pro 2000

New Equipment |  

Hand held pneumatic solder paste dispenser for depositing solder paste on a stencil prior to printing. Eliminates the use of messy paste jars and spatulas. Uses standard 700 gram cartridges. Ideal for use with a semi-automatic or manual stencil pr

Streamline Automation

Double-Ended Sockets

New Equipment |  

Our double-ended sockets addresses the limitations of fixture wiring by eliminating the wire. Available in .100", .075 and .050" center spacing.

QA Technology Company, Inc.

OKTEK FA-931V In-Circuit Tester

OKTEK FA-931V In-Circuit Tester

New Equipment | Test Equipment

Easy operating, statistical data offering, and steady & reliable test system. Static eliminator can avoid the static interfacing.

OKTEK Corporation

antistatic wrist strap

New Equipment |  

Specifications: How it works: skin contacts with conductive material on the wrist strap and Static charges building up on body are discharged to the earth through the grounding system. Elimination time: below 0.1s.

Shenzhen Shinemingesd Co., Ltd

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

SM Compak

SM Compak

New Equipment | Board Handling - Storage

Surface Mount Component Shipper Protects Many Sizes and Styles Eliminates Lead Damage Static Shielding Mailer with Dissipative Inserts 1,2,4 and 10 Paks Available Protect against lead damage SM ComPak® eliminates lead damage when shipping or ha

Conductive Containers, Inc.


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