Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material. Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the po
New Equipment | Fabrication Services
High Layer Count, High Complexity, High Reliability. At i3 Electronics, we offer the total package for your printed circuit board fabrication. We can design, manufacture, assemble, and test your PCB. Our specialty is high layer count, high complexi
New Equipment | Test Equipment
Smart Tweezers, from Canadian, Siborg Systems Inc., are the inventive combination of a powerful LCR-meter and a set of tweezers integrated into a pocket-sized device. Designed specifically for working with electronics using Surface Mount Technology,
New Equipment | Test Equipment
Features & Benefits All Modules Up to 70 GHz Bandwidth and 5 ps Measured Rise Time (10-90%)Lowest Noise for Analysis: 450 μVRMS at 60 GHz, 300 μVRMS at 30 GHz Remote Samplers*1 enable Location of Sampler Near DUT and ensure Best Signal Fid
.jpg)
New Equipment | Design Services
Please contact me when you get a chance: Email:andy@vanch.net skype:andyzhou60 whatsapp:008613477040905 Description Item Number VH-93 Smartphone Specification Parameter:
| 1 |
winsouce.jpg)
.gif)
