BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems 8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems Introductions: The mainly component is adopted international bran
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
8-zone Reduced-Length Lead-Free Convection Reflow Soldering System Introductions: The mainly component is adopted international brand one. Temperature can warm up quickly and keep stable, High effective can save Electronic It is adopted in jointi
Compact machine technology for small and medium-sized production series with convincing price-performance-ratio. Attractive Performance - Attractive Design - Attractive Price With a heating zone length of 1850 mm or 2350 mm the convection reflow
PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semi
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