New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
New Equipment | Test Equipment
The new COMPACT Line collects the inheritance and success of the historic line of SEICA in-circuit and functional testers, designed meeting the requirements of the so called “lean production”, with a specific attention to the requirements of the prod
New Equipment | Test Equipment
Reliable high-quality, high-volume testing for the latest printed circuit board assembly (PCBA) technologies. TestStation in-circuit test systems provide full structural and functional coverage for a wide range of manufacturing, component, process,
New Equipment | Test Equipment
Quickshot XRF already offered a Handheld XRF analyzer for detection of hazardous substances but realized a need for analysis of small electronic components...to meet this interest the desktop QSX-82D was developed. This efficiently designed system
New Equipment | Test Equipment
Non-Multiplexed (1:1) In-Circuit (ICT), fuctional and hybrid test system with IEEE, PXI, Boundary Scan and Flash Programming. The smallest system of the tester family is the MTS30, which is available in a portable 19” rack format. The complete test
New Equipment | Industrial Automation
Yokogawa DCS CS1000 CS3000 ： AAI141 AAV141 AAV142 AAI841 AAB841 AAV542 AAI143 AAI543 AAV144 AAV544 AAT141 AAR181 AAI135 AAI835 AAT145 AAR145 AAP135 AAP149 AAP849 ADV151 ADV551 ADV141 ADV142 ADV157 ADV557 ADV161 ADV561 ADR541 CENTUM：ADV85
Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT environments. Superior Detection with DPIX™ 3D Technology Symbio
Ceramic positive temperature coefficient PTC thermistor help provide protection against power cross, power induction surges and lighting surge defined in ITU, Telcordia, UL. Available in chip, radial-leaded coated and non-coated configuration. This
3D in-line SPI System Volume, Height, Area, Bridge, Offset Laser Triangulation method is applied which least affected by environmental factors. Highest inspection speed and accuracy by 3D sensor head with DSP chip Real-time SPC analys
The most reliable and accurate 3D data Our innovative 3D laser triangulation sensor, RSC profiles exactly real shape of features and also provides very robust 3D data against considerable variations of PCB color and finishing condition, solder mate
