New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
The DV-8000C series Heli-Flow® pumps are the newest generation of encoded auger pumps. The pump has a fixed-head design for luer needle applications. The DV-8000 pump's rigid head and fluid path can withstand high pressures generated by thick fluids
The Microbond line of die attach solder pastes are the best in the industry. Available in RM and NC vehicle systems. Special grades allow for greater metal loading which results in fewer voids under the die.
For Die Attach / Die Bonding / Housing Attach / Housing Bonding
Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printin
DA 90 is a silver filled, high thermal conductive, solvent-free and fast curing thermosetting die attach adhesives. DA 90 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. It can be applied using dis
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
>) or anisotropic conductivity
For Die Attach / Die Bonding / Housing Attach / Housing Bonding
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