New Equipment | Fabrication Services
Flexible PCB includes single sided FPC, double sided FPC and multilayer FPC, etc. Single FPC has chemically etched conductive pattern layer, the conductive pattern layer on the surface of the flexible insulating substrate is calendered copper foil. T
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
New Equipment | Rework & Repair Equipment
The BEST PCB circuit trace repair kit gives you the tools you need for fast modification and repair of PCB circuit traces. Our online PCB repair training videos, our master instructors along with these materials allows you to meet the original PCB qu
New Equipment | Rework & Repair Equipment
The BEST PCB pad repair repair kit gives you the tools you need for fast modification and repair of PCB circuit pads-no matter what their size. Our online PCB repair training videos, our master instructors along with these materials allows you to mee
Double sided model with rinsing and thermostated heater. Etching time 2 minutes with a new ferric chloride at 30°C. Integrated heater Strong Performent Economic & speed Recommended for SMT cards Welded PVC
New Equipment | Solder Paste Stencils
Laser cut stainless steel stencil with etched areas. When huge open spaces have to be produced on the bottom side of a stencil, the etching technology is one opportunity to realize it. The apertures for the solder paste print process are still manuf
The PE-200 is our industrial strength bench top plasma etching system and supplied with an oxygen service vacuum pump. This robust, reliable and yet quite affordable system was developed for the busy 24/7 manufacturing firm that cannot have downtime.
New Equipment | Surface Finish
The Phantom RIE is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based chemistries. The system has a compact, modular design bui
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