New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
New Equipment | Soldering - Other
The CD-B is a soldering station with the JBC Advanced system for general electronic applications. It works with the JBC exclusive heating system and the intelligent sleep & hibernation features. Using the menu you can personalize over 20 parameters
New Equipment | Rework & Repair Equipment
An advanced compact station incorporating JBC technology in one self contained unit. The intelligent sleep and hibernation functions, which help extend tip life and save energy, works so well because JBC's extremely fast temperature recovery, unriv
SUPERIOR VISION 7550 � COLOR, HIGH RESOLUTION INSPECTION The Superior Vision (SV) 7550 AOI color system provides the fastest set-up time in Photon Dynamics� product line. Board programming is both simple and intuitive and is typically performed by
The MicroMesh Stencil System is a unique advanced stencil system explicitly designed and constructed to provide high precision in printing, especially when printing thicker deposits up to and in excess of 500 microns in height. Whether you are workin
The MicroMesh Stencil System is a unique advanced stencil system explicitly designed and constructed to provide high precision in printing, especially when printing thicker deposits up to and in excess of 500 microns in height. Whether you are workin
New Equipment | Rework & Repair Equipment
Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in
New Equipment | Rework & Repair Equipment
There are no complicated controls to worry about with PACE's ST 75 ... just turn a dial to the temperature you need and you're ready to desolder! Self-Contained, Expandable Desoldering Station The ST 75 is a completely self-contained desoldering sy
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