New Equipment | Rework & Repair Equipment
BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
New Equipment | Assembly Services
Edge Plating does not have a set definition per IPC. However, the industry generally accepts this as being copper plating that continues from the top and bottom surfaces and along one or more perimeter edges. Edge Plating can be used for a variety of
New Equipment | Fabrication Services
RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban
Oak-Mitsui is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Oak-Mitsui produces both conventional cladding and
New Equipment | Cable & Wire Harness Equipment
Internal wiring of Appliances or electronic equipment’s where exposed to temperature not exceeding 105℃. Product Specification : Conductor material of Tinned or Bare copper Rated temperature 105°C Rated Voltage 600 V (Spark voltage 6000 V) Fl
New Equipment | Cable & Wire Harness Equipment
Internal wiring of Electric equipments. or where exposed to oil at a temperature not exceeding 105 ℃ Product Specification : Conductor material of Tinned or Bare copper Rated temperature 105 ℃ Rated Voltage 600 V (Spark voltage 6000 V) Flame
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
MIL-P-55110 approved for PTFE materials. Capabilities include PTFE, Thermoset materials, PTFE/FR4 hybrids, edge plating, wrap-around fingers and copper sealed vias.
Using all PTFE, Thermoset and other high performance materials, including epoxy / PTFE hybrids, edge plating and copper sealed vias.
New Equipment | Board Handling - Conveyors
Inverts (flips) Printed Circuit Assemblies upside down for bottom side processing. SMEMA Compatible, touchscreen control, 450mm maximum conveyor width. Two models to choose from. The Anda PCB Inverter / Flipper is a compact inverting module for use
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