New Equipment | ESD Control Supplies
Polyester wiper is constructed from continuous filament microdenier polyester.These strong filaments have a high yarn-to dust contact surface area,ensuring excellent wiping efficiency.Furthermore,its wedge-shaped cross-section acts as squeegies for s
M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E
Flexible data preparation The XMatic software is a modular tool to provide the maximum flexibility to generate equipment data. The Concept is based on the fact that the data extracted from the CAD is invariably incorrent, incomplete or missing. The
The i-CON VARIO 4 multi-channel station meets peak demands in professional soldering and desoldering. Being the i-CON family’s flagship it offers the user 4 tools to master demanding soldering applications. TOOLS ARTICL
Now for nearly a decade, over 3,000 users worldwide are benefiting from the ability to inspect hidden solder joints with the patented ERSASCOPE technology. Industry experts including IPC recognize the critical importance of using ERSASCOPE technology
Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI performance to help you achieve outstanding operational efficiency and high first-pass yield in even the most demanding SMT environments. Superior Detection with DPIX™ 3D Technology Symbio
BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi
New Equipment | Solder Paste Stencils
PNC Inc. uses LPKF Laser Technology to manufacture SMT Solder paste stencil, high tolerance aperture openings with superior registration for it’s solder paste stencils. With it’s 4 mil beam diameter, our Laser is capable of cutting small aperture ope
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
New Equipment | Cable & Wire Harness Equipment
Overview The PullTester 326 is a triple-range, motorized benchtop device for measuring pull forces of crimp connections as well as welded connections. The triple-range capability gives the PullTester 326 incredible application flexibility to handle
