Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
For faster singulation of odd shaped tab routed panels we have developed the N400. This machine uses national brand Die sets with FKN custom tooling to singulate one panel at a time, or to singulate an entire matrix in one operation The N Series Pn
Features: 1. Totally meet various requirements for the lead free processing. 2. WindowsXP operation system, Chinese/English can be swtiched online. 3. Standard air oven, Patent air system, using hot air convection conduction heat faster, more efficie
Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a
Introducing the ezCLIP universal stop clip for PCB magazine racks. The ezCLIP system was created to allow electronics manufacturers who manually load/unload PCB magazine racks a simple way to distinguish required spacing between boards and to prevent
10 Zones Economical SMT Reflow Oven KTE-1000 Heating:10 heating zones Cooling zones: top 2 Weigth: APPROX 2615KG Dimension: 6135*1360*1490mm Product description: 10 Zones Economical SMT Reflow Oven KTE-1000, Heating:10 heating zones, Cooling z
2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
Overview • Almost 20.faster than the original 80C51 at the same frequency • Up to 14.632 VAX MIPS at 100 MHz • Pipelined RISC architecture The DP8051 is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded con
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