Noise Suppression in Computers, Telecommunications, and consumer electronics.
General Purpose (SMT): Chip Inductors and Ferrite Chip Beads
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Gore offers a family of composite organic dielectric materials for chip package substrates and printed circuit boards. Manufactured in high volumes and supplied in standard sheet sizes, each product offers electrical properties, processing advantages
Plastic anti static ic tubes and aluminum rails for shipping sensitive parts, and black conductive for storage and shipping of delicate semiconductors integrated circuits chips and other electronic devices. Anti-static, wafer packaging, plastic anti-
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Laser Depaneling of Populated PCBs Low Cost Option for Depaneling Inexpensive Entry into UV Laser Processing The LPKF MicroLine 1120 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter
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