New SMT Equipment: ferrite chips cracking (Page 1 of 1)

Ferrite Chip Beads and Arrays

Ferrite Chip Beads and Arrays

New Equipment |  

Noise Suppression in Computers, Telecommunications, and consumer electronics.

AEM, Inc.

Magnetics

New Equipment |  

General Purpose (SMT): Chip Inductors and Ferrite Chip Beads

NIC Components Corp.

Underfill Encapsulants for Flip Chips

Underfill Encapsulants for Flip Chips

New Equipment | Materials

Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to

Zymet, Inc

SMT 256  Solder Joint Encapsulant

SMT 256 Solder Joint Encapsulant

New Equipment | Materials

World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati

YINCAE Advanced Materials, LLC.

Dielectric Materials

Dielectric Materials

New Equipment |  

Gore offers a family of composite organic dielectric materials for chip package substrates and printed circuit boards. Manufactured in high volumes and supplied in standard sheet sizes, each product offers electrical properties, processing advantages

Gore

Anti Static IC Shipping Tubes

Anti Static IC Shipping Tubes

New Equipment | IC Packaging

Plastic anti static ic tubes and aluminum rails for shipping sensitive parts, and black conductive for storage and shipping of delicate semiconductors integrated circuits chips and other electronic devices. Anti-static, wafer packaging, plastic anti-

BEE Packaging

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

LPKF MicroLine 1120 S - Laser Depaneling System

LPKF MicroLine 1120 S - Laser Depaneling System

New Equipment | Depaneling

Laser Depaneling of Populated PCBs Low Cost Option for Depaneling Inexpensive Entry into UV Laser Processing The LPKF MicroLine 1120 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter

LPKF Laser & Electronics

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SMT feeders

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Wave Soldering 101 Training Course
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Best Reflow Oven
pressure curing ovens

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Electronic Solutions R3

Low-cost, self-paced, online training on electronics manufacturing fundamentals