Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
Hanwha HM520 MF Pick and Place Machine The Hanwha HM520 MF series mos are a state-of-the-art high-speed modular with extreme flexibility. · Actual productivity is highest among machines of the same class · Optimized to high quality production · Unma
New Equipment | Coating Equipment
The Select Coat® conformal coating machine provides the highest productivity and quality for your automated coating processes. Automate your conformal coating with state-of-the-art process controls, world-leading know-how, expertise in fluid dynam
Hanwha DECAN S1 Pick and Place Machine Speed: 47,000 CPH PCB Size : L510xW510 Feeder input:120pcs Weight: 1600KG Product description: Hanwha DECAN S1 Pick and Place Machine, Speed: 47,000 CPH, PCB Size : L510xW510, Feeder input:120pcs, Weight: 1600K
Inline High Precision CCD fiducial Visual Dispensing Machine This is an inline dispensing machine, connecting other machines at the front and in the back via a conveyor, and communication signals (e.g. SMEMA). Working as an automatic assembly line,
100 different practice boards covering the entire range of SMD components: BGA, QFP, TQFP, TSOP, SOIC, discrete and chips. With fiducials. HASL and Entek available.
The ScreenCut laser stencil cutting system features fast design file conversion and is compatible with Gerber, DFX and other format designs. Set-up and changeover for loose foil or frame mounted material is extremely fast as is throughput - up to an
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
