TP300 is the simplest solution, the most compact-size and lowest-cost solder paste printer, it can be easy and accurate to print the solder paste on any board. Please see details below: 1). It is suitable for both single-sided and double-sided p
TR360 is the simplest solution, the most compact-size and cost-efficient reflow oven, but it is functional over your expectation, fully like the large full-size reflow oven. Please see details below: 1). It is suitable for both leaded and lead-fr
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Mechatronika MS10A stencil printer enables manual application of solder paste to PCB via metal stencil. Solid machanical construction ensures a constantly high printing quality even for fine pitch technology. Four axes independent movements of prin
New Equipment | Solder Materials
As the world's leading developer of advanced solder paste materials, Henkel delivers decades of technology and expertise for optimized process performance. With ground breaking new formulations to provide an easy transition to lead-free as well as pr
New Equipment | Cleaning Equipment
The Low Cost / High Efficiency Stencil Cleaner Stainless Steel Construction Cleans Stencils up to 29" x 29" Low profile allows easy loading and unloading Side mounted “sweep frequency” ultrasonic transducers with 10 year limited warr
New Equipment | Cleaning Equipment
Precision Fine Pitch Aperture Cleaners Thousands of dollars less than fully-automatic cleaners Low solvent usage and running costs Fast cleaning time of 1-3 minutes Minimal waste disposal Portable unit can be used directly on the screen printe
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Full Viscom 2.5D defect detection coverage for placement and solder joint inspection. Extremely reliable, proven inspection for reflow, pre-reflow, wave and selective soldering Revolutionary simplicity in AOI operation with vVision Scalable came
Quick Overview Special for LED board and long PCB printing Fully-automatic screen printer H1200 with automatic recognition function of machine vision, using high-precision servo drive system to achieve fast and accuracy alignment .The precision c
