The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
New Equipment | Education/Training
This course is designed for students that require the hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components. Students are taught methods for safe and reliable BGA component rework using a top of the
The more detail and video please check the link: www.pcb-separator.com This machine specialising the LED assembly industry. with the high precision and all with the CE certify.It use the Europe quality standard and different from our other
New Equipment | Assembly Services
introduction: ZH series is a fully automatic SMT placement machine, it can be mounted various of component through a vacuum nozzle, it is currently on the market cost-effective automatic placement equipment. The machine is suitable for most of the
New Equipment | Rework & Repair Equipment
BGA rework BGA welding BGA welding equipment Power source: AC220V±10％ 50/60Hz Work rate: 4500 W Heating power: Temperature range of the upper temperature range of 800 W lower temperature range of the IR 2400 W, 12
New Equipment | Rework & Repair Equipment
2016 hot collection WDS-700 automatic iphone glued chip rework station with HD camera WDS-700 bga rework station video: https://youtu.be/pmHfF48dRrY Independent 2 heating zones temperature control system Up-heater power: 1200W Down-heater power: 1
New Equipment | Rework & Repair Equipment
Dispensing varied materials across a wide range of viscosities – using the same equipment! Especially solder paste and other filled media have always been particularly demanding when reliable and consistent results are expected. The Clever Dispense e
New Equipment | Rework & Repair Equipment
Future in Advanced Rework. The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the “Built to be Best” philosophy. With a high level of process modularity, the system supports
New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
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