New SMT Equipment: fix coplanarity (Page 1 of 1)

Koh Young KY8030-3 3D Inline SPI

Koh Young KY8030-3 3D Inline SPI

New Equipment | Test Equipment

Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:

Qersa Technology Co.,ltd

KOH YOUNG Zenith UHS 3D AOI

KOH YOUNG Zenith UHS 3D AOI

New Equipment | Test Equipment

KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t

Qersa Technology Co.,ltd

High Force ACF Bonder

High Force ACF Bonder

New Equipment | IC Packaging

Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha

Finetech

  1  

fix coplanarity searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

Reflow Soldering 101 Training Course
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

Software for SMT placement & AOI - Free Download.
best pcb reflow oven

Best Reflow Oven
design with ease with Win Source obselete parts and supplies

"Heller Korea"