Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu
Semi-automatic high precision reflow soldering system assures high volume repeatability and the fastest throughput and flexibility for production. Ideal for applications such as flex to PCB, edge connectors to PCB, ribbon cables to PCB, PCMCIA conne
Manual linear slide reflow soldering system designed for lower volume, high product mix production requirements is also ideal for development work. Designed for for applications such as flex to PCB, edge connectors to PCB, ribbon cables to PCB, PCMC
Automatic Ball Bonder for high pin count devices, complex multichip modules, fine-pitch hybrid microcircuits, ceramic circuit boards,Chip-on-board, and Chip-on-flex.
BGA, flex-BGA, uBGA, CBGA and CSP Dummy Components with daisy chain for solder practice and temperature profiling.
A single slot communication module, tightly integrated into the Allen-Bradley PLC, SLC, ControlLogix and/or FLEX I/O platforms.
Schematic Entry PCB Layout Power Circuit Design EMI and UL Knowledge Surface Mount, Thru-Hole, Mixed Technology, Flex Circuitry Library PCB and Scematic capture Fabrication
Schematic Entry PCB Layout Power Circuit Design EMI and UL Knowledge Surface Mount, Thru-Hole, Mixed Technology, Flex Circuitry Library PCB and Scematic capture Fabrication
Terminal Systems Instrument Panel Cockpit Harness Sectioning Engine Compartment Flex Interconnections Systems Safety Restraints ECU Connectors and Packages Car Multimedia Devices For more information please visit our website
provide the material and qualify the vendors. Electronis circuit design & product development. SMT assembly on PCB and Flex
