Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
New Equipment | Solder Materials
Big-Size Vacuum Soldering Oven for IGBT, MOS 1.Reflow soldering Typically high number of voids cause a large non conductive area 2.Vacuum soldering Very low number of voids, Typically 3.Applications Power Semiconductors;Hybrid
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
For flip chip attachment or electrical grounding ACP's for Electrical Interconnection Zymet's ACP’s designed for electrical interconnection are used for flip chip attachment. Applications include chip-on-glass (COG) attachment of driver IC's and
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