State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With
Cermet Thick Film Materials, Au & Al Wire for Wirebonding, Flip Chip Underfills, Encapsulants, Potting Compounds, Paste & Film Adhesives, COB Die Attach, Solder Alternatives, Conformal Coatings, Vacuum Pick-up Tool, W/B Capallaries and Die Collets
New Generation of Video Microscope for High Quality and Reliable Visual Inspection of solder joints of BGA, uBGA, CSP and Flip-Chip packages. Connecting it to your PC or Laptop to utilize benefits of Digital Image Capture, Measurements and Data Manag
Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
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New Equipment | Cleaning Equipment
All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning. Application: ．LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic c
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New Equipment | Cleaning Equipment
Fast removal of residual photoresist on the wafer, the wafer surface to clean, etch rates with the highest industry. Apllication: ．Surface cleaning and modification for LCD, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging,
The ScanCOMPONENT Product helps in creating vision files for your placement machines. It is its own standalone product or a module within the ScanINSPECT VPI product. ScanCOMPONENT is a PC-based offline component programming system for the creatio
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
PC boards and kits for machine set-up and calibration, hand solder training, rework, practice, testing and more along with a drawing of each PCB. Practical has a PCB board or kit to meet your requirements. BGA Fine Pitch, Global Daisy-Chain or Vari
The 907 micro Placer series allows you to place and rework BGA, mBGA, QFP, and Flip-Chip devices quickly and accurately. This unit is quick and accurate for placing devices with the added option of built in rework. You can place and reflow devices w
