New SMT Equipment: flux corrosion growth (Page 1 of 2)

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

New Equipment | Solder Materials

Kapp Lunar Flux™ is a slurry designed specifically for soldering casted Aluminum, Diecast, Zamak, White Metal and Pot Metal using Alumite™ solder. Residue is electrically conductive and slightly corrosive. Any flux residue should be removed with warm

Solder Direct

Kapp Comet Flux - Low Temperature Soldering Flux

Kapp Comet Flux - Low Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Comet Flux™ has been designed specifically for soldering all common metals except Aluminum. Kapp Comet Flux™ is an activated liquid flux, a mixture of inorganic salts in water, with approximately 35-40% active ingredients. Highly recommended f

Kapp Alloy & Wire, Inc

Kapp Copper-Bond Flux - High Temperature Soldering Flux

Kapp Copper-Bond Flux - High Temperature Soldering Flux

New Equipment | Solder Materials

Kapp Copper-Bond Flux™ has been designed for high temperature soldering of all common metals except Aluminum. Kapp Copper-Bond Flux™ is an activated liquid flux containing a mixture of inorganic salts in water, with approximately 50% active ingredien

Kapp Alloy & Wire, Inc

Soldering Assembly Services

Soldering Assembly Services

New Equipment | Assembly Services

S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillar

S-Bond Technologies

KappZapp7R Rosin-cored Solder

KappZapp7R Rosin-cored Solder

New Equipment | Solder Materials

KappZapp7R Rosin-cored Solder has rapidly become the audio industry standard for electrical / electronic Copper applications. The 7% Silver solder creates extremely clean conductive joints with high strength, ductility and corrosion resistance. The c

Solder Direct

MICRONOX® MX2302 Wafer-level Cleaning Solution

MICRONOX® MX2302 Wafer-level Cleaning Solution

New Equipment | Cleaning Agents

MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302

KYZEN Corporation

STS 1100 - Tinning Station for CrimpCenter

STS 1100 - Tinning Station for CrimpCenter

New Equipment | Cable & Wire Harness Equipment

Overview The STS 1100 tinning station is designed for fluxing and lead-free tin coating of stripped wire ends with cross sections up to 2.5 mm² (14 AWG) and tinning lengths up to 5 mm (0.2''). Optionally, wire ends with cross sections up 4 mm² (12 A

Schleuniger, Inc.

Cobar® Wave Solder Fluxes

Cobar® Wave Solder Fluxes

New Equipment | Solder Materials

Proposal Pro Contra VOC (100% alcohol) 385-D 390-RX-HT 323-ITM Moderate preheating  Reliable  Very known technology

Balver Zinn

KappTecZ - High Temperature Solder for Dissimilar Metals

KappTecZ - High Temperature Solder for Dissimilar Metals

New Equipment | Solder Materials

KappTecZ is a high temperature, high strength solder that may be used on most metals, but works extremely well on aluminum, copper and stainless steel. It has a high tolerance to vibration and stress, and good elongation for use on dissimilar metals.

Kapp Alloy & Wire, Inc

LONOX® L5611 - Stencil and Misprinted Board Cleaner

LONOX® L5611 - Stencil and Misprinted Board Cleaner

New Equipment | Cleaning Agents

LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t

KYZEN Corporation

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