New SMT Equipment: flux residues (Page 2 of 11)

Soldering materials and fluxes

Soldering materials and fluxes

New Equipment | Solder Materials

Soldering materials: Soldering wires Soldering pastes Stencils Soldering shots Soldering balls Fluxes Rosin liquid and gel fluxes Fluxes residues do not cause corrosion http://www.selen.hr/pokaz_kategorie.php?cid=9

Selen d.o.o.

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

Kapp Lunar Flux - High Temperature Soldering Flux for Aluminum and Diecast

New Equipment | Solder Materials

Kapp Lunar Flux™ is a slurry designed specifically for soldering casted Aluminum, Diecast, Zamak, White Metal and Pot Metal using Alumite™ solder. Residue is electrically conductive and slightly corrosive. Any flux residue should be removed with warm

Solder Direct

TAF40 Spray Fluxer

TAF40 Spray Fluxer

New Equipment | Wave Soldering

Stand-alone - matches well with any existing wave solder Minimum flux residue by: Minimal spray pressure Optimum distance from nozzle to PCB Edge-off (Pat. pending) feature Ease of Operation - Touch panel D

Tamura H.A. Machinery, Inc.

Solder Paste

New Equipment |  

Tamura's Solder Paste RMA Series is a solder paste, which consists of RMA type flux satifies QQ-S-571E and spherical solder powder with very little oxide. So flux residue after soldering becomes high reliable coating with excellent insulation resist

Aoki Laboratories Ltd. [Solder Products Supplier]

CYBERSOLV® C8508 - Spray Cleaner for Reflow Ovens

CYBERSOLV® C8508 - Spray Cleaner for Reflow Ovens

New Equipment | Cleaning Agents

CYBERSOLV® C8508 is the latest generation spray cleaner for reflow ovens and general equipment maintenance cleaning. CYBERSOLV® C8508 has been tested on the toughest baked on flux residues with great success and has proven effective on the latest lea

KYZEN Corporation

KYZEN® E5321 - Pallet and Maintenance Cleaning Agent

KYZEN® E5321 - Pallet and Maintenance Cleaning Agent

New Equipment | Cleaning Agents

KYZEN® E5321 is a room temperature pallet and maintenance cleaning agent. This cost effective chemistry removes all types of solder paste and flux residues, including baked on and hardened lead free high temperature flux residues from wave pallets an

KYZEN Corporation

Underfill FF35

Underfill FF35

New Equipment | Materials

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf

AIM Solder

OAJ Cored Wire

OAJ Cored Wire

New Equipment | Solder Materials

OAJ Cored Wire features a halide-activated system that has been neutralized with an amine. The aminehydrohalide provides a high activation level that produces excellent tarnish or oxide removal, and maximum capillary action, leading to faster wetting

AIM Solder

Bioact� EC7M�

Bioact� EC7M�

New Equipment |  

Aerosol 1 Gallon Pail 5 Gallon Pail 55 Gallon Drum Economical Because It's Slower-Drying Great On Hardened Flux Residues Evaporates Completely; No Rinsing Required Powerful Remover of Most Glues, Adhesives and Even Tar Trigger Grip� Compatible

MicroCare Corporation


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