SOLDERITE ULF-210RN, ULF-210RNI, ULF-250, ULF-300VZ-3, and ULF-500VS are ultra low residue type flux and these are developed for soldering printed circuit board mounted chip componenets and flat ICs which are for miniaturize and high density purpose.
New Equipment | Solder Materials
With a variety of formulations for various wave soldering processes, MULTICORE brand high performance liquid flux technology is compatible with dual-wave and lead-free processes, delivering outstanding results. From no-clean to low-residue to VOC-f
New Equipment | Solder Materials
We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. This formula is designed so that the incidence of bridging is rare; likew
New Equipment | Wave Soldering
Basic specification Flux capacity：6L； Flux runoff：10-100ml/min（adjustable）; Preheating zone length:1800mm(600mm×3); Quantity of preheating zone: 3 zones； Preheating temperature: room temperature～250℃; Max. preheating power：14KW; Heating comp
New Equipment | Solder Materials
In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive features of SN100C
New Equipment | Solder Materials
Foreverest™ AX-X Colorless Fully Hydrogenated Rosin is refined from hydrogenated rosin or high-hydrogenated rosin that are eliminated foreign matter. With the benefit of colorless is applied as solid and liquid solder flux. AX-X (http://forevere
New Equipment | Solder Materials
CAS: 65997-06-0 This series of products are refined from hydrogenated rosin or high-hydrogenated rosin that are eliminated foreign matter and the coloring radical. Used in solid or liquid solder flux. Colour, Lovibond Y ≤1.5, R ≤0.3 Acid Value
New Equipment | Solder Materials
CAS: 65997-06-0 This series of products are refined from hydrogenated rosin or high-hydrogenated rosin that are eliminated foreign matter and the coloring radical. Used in solid or liquid solder flux. Colour, Lovibond Y ≤1.5, R ≤0.3 Acid Value
High performance composite materials specifically designed for the PCB assembly process Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT r
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
