New SMT Equipment: fpga thermal bonding (Page 1 of 5)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Thermal Transfer, Thermal Interface Materials

Thermal Transfer, Thermal Interface Materials

New Equipment | Materials

We are well versed in the following thermal application materials:     Sil-Pad thermally conductive insulators     Gap-Pad thermally conductive gap filling material     Q-Pad thermal grease replacement film     Bond-Ply thermally conductive adh

ORION Industries

PCB Epoxy Repair Kit

PCB Epoxy Repair Kit

New Equipment | Rework & Repair Equipment

The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus

BEST Inc.

Advanced Thermal Management

Advanced Thermal Management

New Equipment | Assembly Services

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with

S-Bond Technologies

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

New Equipment | Assembly Services

TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left

Toddco3

Thermal Printer Cleaning Card

Thermal Printer Cleaning Card

New Equipment |  

This specially designed cleaning card cleans thermal print heads that are not easily accessible. The patented presaturated thermal printer cleaning card is saturated with 99.9% isopropyl alcohol. The safe, effective, spun-bonded card allows for the t

KIC Team

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

LEN 66A Optical Bonding Adhesive

LEN 66A Optical Bonding Adhesive

New Equipment | Materials

LEN 66A is one part 100% solid, super fast UV curable bonding adhesives, which has been designed for lens attachment, protective cover windows and touch screens. It can also be used for LCD lamination and sealing, polarizer lamination and touch scree

YINCAE Advanced Materials, LLC.

Permabond - Rapid-Curing, Structural Acrylic Adhesives

Permabond - Rapid-Curing, Structural Acrylic Adhesives

New Equipment | Materials

Permabond structural acrylic adhesives are suitable for bonding a wide variety of materials. The rapid, room-temperature cure coupled with high strength and durability make these adhesives ideal for demanding applications where speed and ease of appl

Permabond Engineering Adhesives

Thermally Conductive Adhesive Double Tape

Thermally Conductive Adhesive Double Tape

New Equipment | Other

Product Description Thermally Conductive Adhesive Transfer Tapes 5715 is designed to provide a heat-transfer path between heat-generating components and heat sinks or other cooling devices, it can be used to seal gaps among PCBs, heat dissipating mo

WE GOT Electronic Co., Ltd

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