Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit
Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit
vacuum pick-up systems are designed for delicate handling of small parts and components, including miniature, surface mount and chip scale packages. Features 1. vacuum pick & place systems using air only, 2.No electricity required for operation
New Equipment | Component Programming
RoadRunner3 with Factory Integration Software modules FIS Remote and FIS Track allows customers to manage and monitor the programming process. RoadRunner3 is the world's only high speed automated just-before-placement inline programming solution tha
Simultaneous Pickup Solution with One Feeder, Highest Speed LED Production System in the World The world's first SLM100 Series LED mounter capable of realizing simultaneous pickup with one feeder. It provides an optimum LED production system. Sim
Replacement tape guides for Fuji CP macines. 8mm and 12mm sizes
New Equipment | Rework & Repair Equipment
VJE Summit 2200 is a fully automated and programmable rework system. It is the latest in a series of systems equipped with a programmable motorized X-Y table, top heater height, pick-up tube , and component theta. Summit 2200 rework system provides
The Fuji NXT is designed to meet the demands of modern production environments. Its interchangeable placement heads allow each machine module to function as either a high speed chip mounter or a multi-function placement machine. Heads are fast and
New Equipment | Solder Paste Stencils
Stentech produces mini stencils; small stencils that are used mainly for BGA re-work. Mini stencils are designed to deposit precise amounts of solder paste for single BGA footprints on loaded PCBs. These precision stencils mimic the footprint and ape
The Model 9000 operates using a self-contained vacuum system to secure the BGA component while transferring the desired pattern of solder sphere's in a full array. Alignment is achieved through precision pins and specific tooling for ease of use, re
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