The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces the new ezLOAD PCB Support System. With the recent increase of densely populated double-sided circuit boards, COT recognized the need for more affordable
New Equipment | Test Equipment
The ENGMATEC test handler is characterized by the wide-ranging spectrum of applications for in-circuit, functional or end tests. All components of the module system are matched with each other and can be combined with each other as well as with vario
New Equipment | Test Equipment
The standard range of products comprises mechanical and pneumatic test adapters for functional tests of assemblies and equipment. The comprehensive adapter system is characterized by very flexible fields of application. The test equipment is designed
New Equipment | Test Equipment
ENGMATEC offers a range of test plugs for in-circuit and functional tests of standard industrial interfaces. The test plugs are designed to speed the production testing of electronic equipment incorporating a range of standard interfaces including
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
Device control via internal JTAG access - processor and FPGA cores While many ICs are equipped with a JTAG (IEEE Std. 1149.1) boundary-scan register (BSR), a significant number of microprocessors and DSPs can be found with deficient or even non-exi
Functional Applications Fiber Optic Links, High Isolation Decoupling, LAN’s, VCO Frequency Stabilization, Diplexers, RF/Microwave Modules, Instruments and Test Equipment. Benefits Resonance free DC Blocking / Decoupling, Less than 0.25 db loss @
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