Base material: FR4 Layer count: four layer Board thickness: 1.6mm Copper thickness: 2 oz Surface finish: Immersion Gold Solder mask color: Green Sizes: 262 x 185/1up
Base Material: FR4 Layer count: four layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: Immersion Gold Soldermask Colors: blue
New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
EzPCB offers various kinds of surface finishing technology, including Sn/Pb, Ni/Au, immersion gold, chemical silver etc. Lead-free OSP finishing technology is our newly introduced service, and is welcomed by customers in the EU, US and in Austrilia.
Material: High Frequency Layer No.: 2 layer Board thickness: 1.60mm Copper thickness: 1 oz Finishing: Electrical Gold
New Equipment | Assembly Services
Technic Feature Layer Count:6 Layer Board Thicknes:1.57mm Surface Finish：HASL+Gold Finger Application Field:Computer display card
8-layer PCB with impedance control. Surface Finish: Immersion Gold
Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 6 layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 6 mil Finishing: Immersion Gold + Hard Gold
New Equipment | Fabrication Services
Base Material: FR4 Layer count: two layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish:Gold finger Soldermask Colors: Red Size:119.5*76.7/1up
