New SMT Equipment: gold tin (Page 1 of 3)

long wave infrared reflow and curing ovens

New Equipment |  

IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2

ROBOTHERM

Microwave RF PCB

Microwave RF PCB

New Equipment | Other

General specification for Microwave/RF PCB Layer count: 1-6 Board thickness: 0.2-3.2mm Copper thickness: 0.5-4oz Dielectric Constant(DK): 2.2-10.3 Min trace width/spacing: 4/4mil Min drill hole size: 0.2mm Surface treatment: HAL(Lead free), I

A-Tech Circuits Co.,Limited

2 Layer FPC

2 Layer FPC

New Equipment | Components

Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD

Headpcb

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

Multilayer PCB

Multilayer PCB

New Equipment | Inspection

Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width

Multycircuit Technology Limited

Printed circuit board

Printed circuit board

New Equipment | Assembly Services

Shenzhen YatSing PCB Co,.Ltd has been supplying printed circuit boards since 1981 ,as a leading manufacturer of Printed Circuit Boards in China,we provide excellent quality and lower price(specially lower price in single&double layer boards),and we

Yat Sing Printed-Wiring Boards Fty.Ltd

AuSn Solder Electroplating

AuSn Solder Electroplating

New Equipment | Solder Materials

AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl

Micralyne Inc.

PCB prototypes & production

PCB prototypes & production

New Equipment |  

Zoomtak Electronics is an electronics manufacturer for printed circuit boards for years. We offer PCB production service for a variety of PCB types and quantities: Single-sided, double-sided, and multi-layer boards CEM-1, FR-4, FR-4 TG170, Aluminum

Zoomtak Electronics Co.,Ltd

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