Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 6 layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 6 mil Finishing: Immersion Gold + Hard Gold
New Equipment | Education/Training
Create your passive income in the company EmGoldex. For anyone who is going to grow as a person and get a 6,500 euro per month! Online store selling, gold bars from 1 to 100 grams in the bonus program. Create your own business! http://goldpu
1~26 layers, High Mix low volume to Mass production. FR4-Tg140~200. Surface finish OSP, Immersion gold, Immersion silver, Immersion tin, Hard gold plating etc. Finish copper up to 6oz. HDI 2+N+2 Capability.
Gold / Aluminum / Copper Bonding Wires The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extr
1��Materials��FR-4��CEM-1�� High-Tg170, Teflon, Aluminum-base, Iron-base 2��Layers: Single, Double Side, Multi Layers (Less than 22 Layers) 3��Finished Surface: HAL,Lead Free HAL, Immserion Gold,Plating Flash Gold, O.S.P., Gold-Finger, Carbon Ink, P
New Equipment | Design Services
Layer：4 Material：FR-4 4/4/4/4oz Thickness：2.0 Minimum hole：0.35mm Minimum Tracc/Spacing：12mil/15mil Application：power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space:
Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width/space: 3mil/3mil Min
Layer: 6 layers Material: FR-4 Board Thickness: 1.0mm Surface Finish:ENIG Copper Thickness: 1 oz all layers Blind via L1~L2 and L1~L3 Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ Min line width
New Equipment | Solder Paste Stencils
MET Stencil announces a new sprayed on baked on coating called NanoSlic Gold. We are currently offering a no charge sample to all of our new, and existing customers. Using advanced polymer chemistry, this coating has been developed to address the inc
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