The only portable reflow oven optimizers with statistical process control (SPC). Regardless of the recipe and what your reflow oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANT
Three (3) heating zone reflow oven for batch production runs utilizing our patented Horizontal ConvectionTM Heating technology for extremely uniform temperature profiling across the board for enhanced process control. The GF-120HT is lead-free compat
New Equipment | Board Handling - Pallets,Carriers,Fixtures
The award winning KIC profilers provide accurate and quick profiling, as well as optimum oven set up. Facilitates Reflow Profiling Works on Edge Conveyors with and without Center Board Support Profile Low Clearance Ovens Accomodates Extra Wide
New Equipment | Rework & Repair Equipment
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencils and masks for almos
Near Equilibrium Hot Gas Heating makes the CUREFLOW series the only choice for SMT Convection reflow and curing applications. 3 models to choose from.
The Sirocco an economical, in-line reflow oven using C3, full convection, laminar heat transfer technology. Ideal for medium to high volume production, Sirocco ovens offer minimal variation in temperature across the conveyor.
-Individual module heat zone design is convenience for maintenance -Adopts ��Star Shape Heater�� that is high solder performance for BGA, QFP components
Higher throughput reflow oven with 20" (508mm) wide conveyor for production runs. The 2000HT reflow oven utilizes our patented Horizontal Convection Heating technology for extremely uniform temperature profiling across the board for enhanced process
rehm's "Compact" and "SMS" series of full convection reflow ovens is now available in North America. Modular design principles allow virtually any combination of heating and cooling sections, as well as conveyor and process-atmosphere sub systems.
3°C/sec. Excellent ROI (Return of Investment). Wide process window for “universal profiling”. 50% less Nitrogen consumption than other systems.
