New SMT Equipment: hot bar bonder (Page 1 of 4)

ACF Bonding

New Equipment | IC Packaging

Pulsed Heat Hot Bar Bonders, Computerized Control Systems, FPD Workstations

Microjoin

PHM Hot Bar Soldering and Bonding Machines

PHM Hot Bar Soldering and Bonding Machines

New Equipment | IC Packaging

Fancort's Hot Bar Bonding and Soldering machines are easy to use, robust and economical for bonding flex to rigid assemblies such as Flex to PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB. Microprocessor based controller provides precis

Fancort Industries, Inc.

Hot Bar Soldering

New Equipment |  

Reflow Systems, Power Supplies, Reflow Heads, Custom Fixtures

Microjoin

Electrode Tips and Bars

New Equipment |  

Ceramic Hot Bars, Metal Heater Bars, Custom Fixtures, Weld Tips,

Microjoin

Hot Bar Soldering Machines

New Equipment | Other

We offer a number of soldering machines for bonding Flex to PCB, Connector to PCB and micro cables to PCB/ connectors.

Production Technologies Ltd

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

New Equipment | Assembly Services

TG-1000 Hot Bar Bonding System TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include: • Floor standing base frame & leveling legs with righ or left

Toddco3

FINEPLACER® pico ma - Multi-purpose Bonder

FINEPLACER® pico ma - Multi-purpose Bonder

New Equipment | IC Packaging

A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon

Finetech

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

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hot bar bonder searches for Companies, Equipment, Machines, Suppliers & Information

Win Source Online Electronic parts

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Fluid Dispensing, Staking, TIM, Solder Paste

Training online, at your facility, or at one of our worldwide training centers"
IPC Training & Certification - Blackfox

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
Voidless Reflow Soldering

Reflow Soldering 101 Training Course
2024 Eptac IPC Certification Training Schedule

Software for SMT placement & AOI - Free Download.
Hot selling SMT spare parts and professional SMT machine solutions

Thermal Transfer Materials.