Lafutidine Cas No: 118288-08-7 Appearance White to almost white powder Total impurities:not more than 1.0% Maximum single impurity: not more than 0.5% Loss on drying: Not more than 1.0% Residue on lgnition: Not more than 0.1%
Percent to ppb level of impurity detection; single or dual detector; isothermal or temperature programmable; educational, laboratory or industrial applications; TCD, DID, FPD, PIP or FID detectors; corrosive & non-corrosive gas applications
Analysis of Impurities in Argon; Sensitivities: H2 20 ppb, CH4 50 ppb, O2 100 ppb, CO 500 ppb, N2 100 ppb
New Equipment | Solder Materials
Manufactured by a special process that controls the inclusions of oxides and metallic and non-metallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronic applications where lower surface tension and hole
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AMTECH’s Premium Bar Solder is designed to meet today’s sophisticated electronic manufacturing processes by providing a strong and reliable solder joint. All AMTECH bar solder is manufactured from a variety of high purity virgin metals that exceed th
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SD600 PCBA Batch Cleaner Features 1、Visualization of the whole process: Cleaning room equipped with visual window, cleaning process be clear at a glance ； 2 、The world‘s largest cleaning baskets: 645mm(L) ×560mm(W) × 200mm(H) 2 lay
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Very Competitive price, Super quality. Adopted by many big factories, like Siemens/Foxccon/Flextronics/Honeywell/ALPS etc. SD-1800 STENCIL CLEANER Features ● Used for cleaning solder paste, glue,etc. ●Completely pneumatic operating without fire
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Solder Bar is made solely from high purity metal, produces a low proportion of dross and its suitable for dip and wave soldering. The quality meets JIS-Z-3282. Solder Bar is available specification in A grade, S grade, Anti-oxide bar, Silver added ba
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New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
