New SMT Equipment: interposer (Page 1 of 1)

BGA Reballing Service

BGA Reballing Service

New Equipment | Rework & Repair Services

BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

BGA Rework Services Offered  BGA Remove and Placement Level Three Pad Repair Wire Add Trace Repair BGA Re-Balling BGA Inspection We Rework PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum

Precision PCB Services, Inc

BGA / SMT Rework & Repair

BGA / SMT Rework & Repair

New Equipment | Rework & Repair Services

Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb

Process Sciences, Inc.

BGA Reballing Services

BGA Reballing Services

New Equipment | Rework & Repair Equipment

Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a

Process Sciences, Inc.

BGA Rework Services

BGA Rework Services

New Equipment | Rework & Repair Services

Process Sciences specializes in the rework of BGA, LGA and QFN devices, BGA connectors, and various styles of bottom terminated SMDs. Driven by customer demands in the early 1990's, PSI developed custom convection air rework solutions for BGA dev

Process Sciences, Inc.

SourcePoint® Platform for Software Debug and Trace

SourcePoint® Platform for Software Debug and Trace

New Equipment | Test Equipment

One platform for debug and trace (SourcePoint™) SourcePoint™ (formerly an Arium product) is a platform of debug and trace tools for C/C++ embedded software and firmware for either Intel® or ARM® systems. This robust environment features multiple vie

ASSET InterTech, Inc.

C-TurnFlux - Automated Flux Dispensing and Hot Bar Reflow Soldering

C-TurnFlux - Automated Flux Dispensing and Hot Bar Reflow Soldering

New Equipment | Soldering Robots

The C-TurnFlux is the topline product for automated Flux Dispensing in combination with automated Hot Bar Reflow Soldering. An ultimate system for high end applications, where output and quality inspection are required. A motorized, five position ind

C-Tech Systems, B.V. [formerly Nordson DIMA]

IC670ALG230 Analog Input Current 8 Pt. Grouped

IC670ALG230 Analog Input Current 8 Pt. Grouped

New Equipment | Components

IC670ALG230 Analog Input Current 8 Pt. Grouped  IC670ALG240 Analog Input Current 16 Channel  IC670ALG620 RTD 4 Channel Isolated 3 wire  IC670ALG630 TC 8 Channel       IC670ALG310 Analog Output Voltage, 8 Channel, +/-10V, 0 to 10V  IC670ALG320 A

zhengzhou yuzhe electronic technology co.,ltd

ABB 07AB200

ABB 07AB200

New Equipment | Industrial Automation

Part Number Part Type Description 07 AA 60 R1 GJV 30 743 65 R1 Analog Output Module 07 AA 61 R1 GJV3074366R1 07AA61R1 Analog Output Module - 4-20ma 07 AA 62 R1 GJV 30 743 Analog Output Module 07 AA 63 GJV3074368R1 Analog Output Module 07 AA 65 R

zhengzhou willing electronic technology co.,ltd

ABB 07AB200-CPU

New Equipment | Industrial Automation

Part Number Part Type Description 07 AA 60 R1 GJV 30 743 65 R1 Analog Output Module 07 AA 61 R1 GJV3074366R1 07AA61R1 Analog Output Module - 4-20ma 07 AA 62 R1 GJV 30 743 Analog Output Module 07 AA 63 GJV3074368R1 Analog Output Module 07 AA 65 R

zhengzhou yuzhe electronic technology co.,ltd

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interposer searches for Companies, Equipment, Machines, Suppliers & Information

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convection smt reflow ovens

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