New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Cleaning Equipment
CM11 , CM 22, CM33. CM60 – Ionic Contamination and Cleanliness Test Systems to MIL & DEF standards.
New Equipment | Cleaning Equipment
World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz
Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant
For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a signifi
TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci
TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci
Made from 100% nitrile, a preferred alternative to the traditional natural rubber latex fingercot. The QRP proprietary formulation of 100% nitrile is completely free of latex and latex proteins. Inherently anti-static, the 9C fingercot is ideal for u
For die attach and general electronics assembly Die Attach Adhesives Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syring
For encapsulation of wirebonded IC’s Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline
