New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Cleaning Equipment
Digicom Electronics’ Diamond Track Cleaning Process, winner of the 2012 Global Technology Award, is a highly efficient, in-line cleaning system aimed at mitigating failures caused by contaminated PCBs. Our innovative Diamond Track Cleaning Process use
New Equipment | Assembly Services
100% manufacturability check prior to production IPC Class 2 specifications 100% electrical test on all boards Fully-finished PCBs with 2 solder-masks and 1 or 2 silk-screens Full finish on copper: HASL, RoHs, gold or silver . 1
New Equipment | Assembly Services
- Full ESD safe factory with regular mandatory ESD level checks. - Humidity controlled storage for components & PCB's. - SMT pick & place from 0402 to QFP/BGA. - 8 zone convection reflow for SMT components - PCBs up to 300mm width. - Wave solderi
New Equipment | Solder Materials
Whether you are a hobbyist, sheet metal fabricator, or an electronics assembler, StellarTechincal.com provides quality solder for you, including lead-free solder wire. When you shop online at our business, you’ll be able to get a solder bar, babbit f
New Equipment | Selective Soldering
The Vitronics Soltec mySelective 6747 selective soldering automation workcell is ideal for soldering tall bottom side components, delivers great results as an alternative for pin-in-paste, and is perfect for safeguarding temperature-sensitive compone
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
In response to many inquiries from GC-Prevue users, GraphiCode created GC-PrevuePlus to fill the need for an inexpensive Gerber translator and editor. Building on proven functionality from GraphiCode's existing family of products, GC-PrevuePlus takes
IPC is the trade association for the printed wiring board and electronics assembly industries.
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Phone: 847-615-7100