TR360 is the simplest solution, the most compact-size and cost-efficient reflow oven, but it is functional over your expectation, fully like the large full-size reflow oven. Please see details below: 1). It is suitable for both leaded and lead-fr
reflowsystems.com manufactures and distributes three series of ovens to offer a perfect fit in size and price for every production need: 1) CORA 450 and 250 are combining not only COnvection and RAdiation to guarantee stressfree soldering of BGAs eve
New Equipment | Rework & Repair Equipment
The new MiniOven-05 is a compact and versatile IR reflow oven suitable for a wide range of SMD components. This newest version provides enhanced process capability with updated firmware and increased control and temperature stability. The highly eff
Description: TEMT6000 is a silicon NPN epitaxial planar phototransistor in a miniature transparent mold for surface mounting onto a printed circuit board. The device is sensitive to the visible spectrum. FEATURES Adapted to human eye responsivity
New Equipment | Rework & Repair Equipment
IR2015 Infrared reflow soldering section of BGA rework system Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution. PL2015 Precise
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
New Equipment | Rework & Repair Equipment
Infrared BGA & SMT Rework at a Price that Can't Be Beat! The IR 1000 is a low-cost, remarkably flexible and effective rework system, capable of installing and removing passives, QFP's, SOIC's, PLCC's, MLF's, LCCC's, TSOP's, QFN's and BGA's. It is id
New Equipment | Solder Materials
Trade names: Solder Pallet Material, Carbon Fiber Glass Reinforced Sheet Available Shapes: Sheet Color: Black Sheets Thickness: 0.3mm ~ 80mm
