Kester - With over 100 years of manufacturing experience, Kester is a leading global supplier of higher performance interconnecting materials and related services for the electronic and micro-component assembly markets. Kester offers the following so
New Equipment | Solder Materials
Kester wire products have been developed to provide superior performance for hand soldering in the electronics industry. While the globally available preferred products are listed below, other combinations and core fluxes may be available. The Kester
New Equipment | Solder Materials
Lead-free wave and selective soldering systems require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new acti
New Equipment | Solder Materials
Kester offers a complete line of solder paste to fit the needs of the electronic assembly market. The preferred products below cover the complete range of application types including No-Clean, Water Soluble, Halogen-Free and Lead-Free.
Practical is the exclusive distributor of mechanical samples from Amkor as well as being the leading supplier of samples from Tessera and K&S Flipchip division. Practical prides itself on being the leader in on-time delivery; value added service and
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
New Equipment | Cleaning Agents
LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
New Equipment | Solder Paste Stencils
NiEX™ electroformed stencils use the same proprietary process as our market leading AMTX™ stencils. The NiEX™ stencil has a higher Knoop Hardness (HK) than our standard AMTX product for those very thin less than .003 applications such as wafer bumpin
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
