Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
New Equipment | Wave Soldering
Automatic wave solder system with self-contained fluxing, preheating and laminar (smooth) solder wave modules. Wave Solder Machines for Lead-Free Soldering Medium to High Volume Production Automatic wave solder system Best value through
New Equipment | Wave Soldering
Automatic wave solder system with self-contained fluxing, preheating and laminar (smooth) solder wave modules. Wave Solder Machines for Lead-Free Soldering Medium to High Volume Production Automatic wave solder system Best value through
New Equipment | Assembly Services
TW-FPC--Flexible PCB 0187 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units p
SemiPack provides a complete outsourced solution for the preparation and packaging of electronic components, servicing original equipment manufacturers, electronics manufacturing services (EMS) providers, contract assemblers and distributors. SemiPac
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New Equipment | Cleaning Equipment
All kinds of printing or adhesive substrate before the surface activation, modification, grafting, roughening or cleaning. Application: ．LCM, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED packaging, SMT, PCB, FPC, optoelectronic c
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New Equipment | Cleaning Equipment
Fast removal of residual photoresist on the wafer, the wafer surface to clean, etch rates with the highest industry. Apllication: ．Surface cleaning and modification for LCD, IC Packaging (Flip Chip, CSP, BGA, Lead Frame, etc.), LED Packaging,
Lead Tinning is an important aspect when components need to withstand adverse conditions for extended periods. Lead Tinning can also be used in the restoration of corroded components to their original condition. V-TEK meets or exceeds Mil standards.
Surface Mount Technology (with BGA's) Mixed Technology Through-Hole Technology Rigid, Rigid Flex, and Flex Circuit assembly Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced) Conformal Coat Systems Integration and Box Bu
New Equipment | Wave Soldering
Economic, low to medium, automatic, 11.8" (310mm) wave soldering system with "L" finger conveyor for pallet or pallet-less board transport. The EWS-310 Wave Soldering Machine provides quick loading of PCBs from the onload conveyer extensions onto t
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