High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Board Handling - Conveyors
product instruction ※Stable and reliable integrated control system ※Floding down and special air circuit design. lifting speed smoothly ※ Smooth and parallel width adjustment (lead screw) ※ SMEMA port is compatible Model No：KSUN 350
New Equipment | Board Handling - Conveyors
product instruction ※Stable and reliable integrated control system ※Floding down and special air circuit design. lifting speed smoothly ※ Smooth and parallel width adjustment (lead screw) ※ SMEMA port is compatible Model No：KSUN 460
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
We are well versed in the following thermal application materials: Sil-Pad thermally conductive insulators Gap-Pad thermally conductive gap filling material Q-Pad thermal grease replacement film Bond-Ply thermally conductive adh
New Equipment | Education/Training
This two day course is based on the IPC-7721. Students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate, plated through holes and more. Students will be introduced to the proper techniques for SMT & PTH compon
Waterjet allows for improved cutting tolerances, improved lead times and the ability to provide highly complex geometry. Using a stream of water with forces of 55,000 PSI yields fast production rates and tool free cutting. Our single head and 4-head
New Equipment | Education/Training
In this One-Day class you will learn successful techniques to re-ball BGA Components. Both Lead and Lead Free Solder Balls will be covered. The student will have an opportunity to use and evaluate some of the most popular BGA rework fixtures on the
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
FUJI CYLINDER/SHAFT/SILENCER/GUIDE FUJI IPH4540 NOZZLE ASSY 20,0 XL Z-AXIS FUJI IPH4541 NOZZLE - LL IP / IP2 PICK UP NOZZLE IP / IP2 PIC FUJI IPH4610 DISPERSION SHEET 4,0/7,0/10,0 FUJI IPH4620 DISPERSION SHEET 2,5 FUJI IPH5030 BRACKET FUJI IPH5270 B
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