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Layer Count: 8L Board Thickness: 1.0mm Panel Dimension:190*86mm/2up Material: S1141 Copper on board surface: 35μm Min Hole Diameter: 0.1mm Min line Width/Space: 8/8mil Surface Finish: ENIG+Selective OSP in BGA area This quick turn PCB is manufacture
The unique electrical, thermal and mechanical properties of aluminum combined with Polyonics proven coating, adhesive and manufacturing technologies provide high quality tape material ideal for high temperature applications. In particular, Polyonics
Novec Surface Modifiers protect your electronics components quickly economically and safely. Drying to a transparent layer of just 1 micron, Novec surface modifiers offer superb resistance to moisture, oils and other contaminants in a third of the ti
Looking for a kit to do it all! This is the most complete and versatile circuit board repair kit you'll find anywhere. This kit is used to repair plate through holes, damaged circuits, lands, surface mount pads, and gold edge contacts. It includes ma
Material: Aluminium Layer Coverage: 1Layer Thickness: 1.6mm Surface Technique: HAL Line Width/Space: Solder Mask Color: Black silk screen:white We sincerely hope to establish longtime and friendly business relationship with you. Good quality, re
Material: CEM-1 Layer: 1 Thickness: 0.8mm Surface treating: Pb free HAL Solder mask: Green Min. Line/Space: 0.2mm Min. Hole: 0.3mm Lead Time: Sample 3 days S. 5 m2, 10 days Profiling: Routing Copper: 1oz Electronical Test We are always
1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask
1). 1+C+1 HDI, blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nickel
Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi
Specification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture Quality report: Solderability
