New SMT Equipment: maximum flip (Page 1 of 2)

INSIGNUM 4000 Laser - High-End Laser PCB Marking System

INSIGNUM 4000 Laser - High-End Laser PCB Marking System

New Equipment | Other

The high-end system in the series is the INSIGNUM 4000 Laser which exhibits the highest precision at an impressive cycle time of less than 4.8 seconds. The ASYS inline Laser marking system, INSIGNUM 4000 Laser, is used for direct laser marking of so

ASYS Group

Chip Attenuators

Chip Attenuators

New Equipment | Components

Since 1977, Barry Industries has manufactured the highest quality chip attenuators available. All chip attenuators are designed and manufactured in our 40,000 square foot facility in Attleboro, Massachusetts USA. Vertical Integration is our key to en

Barry Industries, Inc.

S3016 - Bottom-Up AOI

S3016 - Bottom-Up AOI

New Equipment | Inspection

Solder joint inspection of bottom-side PCBs Intelligent Inspection of Solder Joints, THT and SMD Components Today, the industry standard quality assurance in electronics production is automatic optical inspection (AOI) of SMD components on printed

Viscom AG

Siemens Siplace D series Machines

Siemens Siplace D series Machines

New Equipment |  

SIPLACE D1 � Flexible Placement Machine With the flexible end-of-line machines SIPLACE D1 and SIPLACE D1s the SIPLACE team completes the new SIPLACE D-Series generation. The new placement machines can be alternatively equipped with one (SIPLACE D1s)

Extreme Systems Technology Phils., Inc.

FINEPLACER® pico ma - Multi-purpose Bonder

FINEPLACER® pico ma - Multi-purpose Bonder

New Equipment | IC Packaging

A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon

Finetech

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

SLM100 Series - High-Speed, SMART LED Mounter

SLM100 Series - High-Speed, SMART LED Mounter

New Equipment | Pick & Place

Simultaneous Pickup Solution with One Feeder, Highest Speed LED Production System in the World The world's first SLM100 Series LED mounter capable of realizing simultaneous pickup with one feeder. It provides an optimum LED production system. Sim

Hanwha Techwin CO., LTD.

Genesis SMT Pick and Place Series

Genesis SMT Pick and Place Series

New Equipment | Pick & Place

The ideal solution for any market. Genesis features a powerful combination of speed and flexibility to blur the boundaries between high-speed and flexible fine pitch placement. Outstanding price performance combines with traditional Universal uptime

Universal Instruments Corporation

Mega™ ION Batch PCB Cleaners

Mega™ ION Batch PCB Cleaners

New Equipment | Cleaning Equipment

World’s First Cleaner & ROSE Tester Removes Fluxes Performs IPC ROSE Test Closed Loop Operation - No Drains Aqueous or Organic Solvents Stainless Steel Construction Automatic Wash/Rinse/Test/Dry 230VAC, 10AMP, 50/60Hz

Austin American Technology

Fuzion SMT Pick and Place Series

Fuzion SMT Pick and Place Series

New Equipment | Pick & Place

Fuzion® is Universal’s flagship platform, leveraging the latest generation of head and feeder technologies, and software tools for maximum performance. Fuzion solutions maximize utilization, Overall Equipment Effectiveness (OEE), and productivity whi

Universal Instruments Corporation


maximum flip searches for Companies, Equipment, Machines, Suppliers & Information

Online Equipment Auction of Altronic: Small-Batch Surface Mount & Assembly Facility

Wave Soldering 101 Training Course
Solder Paste Dispensing

High Precision Fluid Dispensers
PCB Handling Machine with CE

Best Reflow Oven
2024 Eptac IPC Certification Training Schedule

High Resolution Fast Speed Industrial Cameras.
Electronic Solutions R3

Low-cost, self-paced, online training on electronics manufacturing fundamentals