New SMT Equipment: maximum smd component (Page 1 of 94)

860 Pressure Curing Oven (PCO)

860 Pressure Curing Oven (PCO)

New Equipment | Curing Equipment

A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with

Heller Industries Inc.

Peel Back Force Tester (PBFT)

Peel Back Force Tester (PBFT)

New Equipment | Pick & Place

Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble

GPD Global

High Precision Dispenser - MAX II (Heated Dispenser)

High Precision Dispenser - MAX II (Heated Dispenser)

New Equipment | Dispensing

Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

KSUN R05 JUKI Feeder Calibration

KSUN R05 JUKI Feeder Calibration

New Equipment | Pick & Place

KSUN R05 JUKI Feeder Calibration It is essential for this equipment that enhanced productivity , installation and quality improvement As the high efficiency vision camera is asked in order to investigate precisely and repair the error of device pos

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DH-800 Robot Automatic Dispenser

New Equipment | Soldering Robots

Model: DH-800 Robot Automatic Dispenser product model: DH-800D Dispensing range: 300/300/90 maximum load Y/Z:  10KG/6KG Speed X& Y/Z(mm/sec)   500/500/300 external dimensions : 465*495*697mm Body weight(KG): 42 capacity of decomposition :0.01m

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Chip Quik SMD Rework Products

Chip Quik SMD Rework Products

New Equipment | Rework & Repair Equipment

We are a distributor of Chip Quik SMD rework products. Call for pricing or check out our on line store:  https://youtu.be/DBJ1MxqD3d0 (888) 406-2830

Precision PCB Services, Inc

JUKI JM-20 Hybrid Placement Machine

JUKI JM-20 Hybrid Placement Machine

New Equipment | Pick & Place

JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603~50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603~50mm, Place Speed:15,500 CPH  

Qersa Technology Co.,ltd

PCB Depanelers/depanelizing pcb/PCB depanelizer/PCB cutter/ 基板分割機.基板切断機

PCB Depanelers/depanelizing pcb/PCB depanelizer/PCB cutter/ 基板分割機.基板切断機

New Equipment | Depaneling

 The PCB Depanelers more detail and video please check the link: www.pcb-separator.com           Any inquiry please sent the email to : info@pcbasc.com   This machine can use for all kinds of PCB board. 1. Cutting with the double straight knives,

ASCEN Technology

WDS-900 Nitrogen Capable SMD & BGA Rework Station

WDS-900 Nitrogen Capable SMD & BGA Rework Station

New Equipment | Rework & Repair Equipment

The Model WDS-900 is a top-of-the-line Nitrogen Capable BGA Rework System with a High-Resolution Split Vision Optical System for Removal, Placement, and Soldering of BGAs, CGA's, CSPs, QFPs, LGA's and Other SMDs.  An excellent BGA Rework Machine or f

Precision PCB Services, Inc

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World's Best Reflow Oven Customizable for Unique Applications
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