170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
New Equipment | Cable & Wire Harness Equipment
Overview The ESU 6 ElectrolyteStaining Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Very simple handling Efficient and quick cleaning Cleaning dir
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger’s MicroGraph System allows the creation of high-quality crimp cross-sectional images in a fraction of the time needed with “conventional” methods. The system is comprised of modular components that can be combined according to
New Equipment | Cable & Wire Harness Equipment
Overview The SPU 60 Saw & Polishing Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Excellent cutting surface Sawing & polishing in one working step
New Equipment | Cable & Wire Harness Equipment
Overview The SPU 6 Saw & Polishing Unit is a component of the MicroGraph System for the creation of high quality cross-sectional images of crimp connections and others. Very simple handling Efficient and quick cleaning Cleaning directl
New Equipment | Cable & Wire Harness Equipment
Overview Microscope for visual analysis of cross-sectional images of crimped connections. Precise results in real-time Simple connection and installation with standard PC Clear illumination with LED ring light Analysis according to
New Equipment | Cleaning Equipment
Aqueous and Semi-Aqueous PCB Cleaning Systems The MicroJet™ Inline cleaning System with Progressive Energy Dynamics™ provides the highest level of SMT cleaning available on the market today. Progressive Energy Dynamics (PED™) is a proprietary spray
State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With
The YXLON Cheetah EVO series was designed to provide the "best-in-class" inspection solution for SMT, semiconductor, and laboratory assembly applications. With optimitzed software and hardware, these systems produce higher quality and more consistent
The YXLON Cougar EVO series was designed to provide the "best-in-class" inspection solutions for SMT, semiconductor, and laboratory assembly applications, while maintaining a small system footprint for maximum convenience. With optimized software and
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