Hanwha DECAN S1 Pick and Place Machine Speed: 47,000 CPH PCB Size : L510xW510 Feeder input:120pcs Weight: 1600KG Product description: Hanwha DECAN S1 Pick and Place Machine, Speed: 47,000 CPH, PCB Size : L510xW510, Feeder input:120pcs, Weight: 1600K
Hanwha DECAN F2 Pick and Place Machine High Speed:120,000 CPH Ultra Slim Design with a Total Length of 1.25m Applies High Rotary Modular Head Side-view Vision System Product description: Hanwha DECAN F2 Pick and Place Machine High Speed SMT Modular
New Equipment | Assembly Services
Hanwha DECAN S1 SMT Assembly Line Hanwha DECAN S1 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
Our Bio-Tech Services division provides processes on a contract basis to companies engaged in the design and manufacture of various types of microfluidic devices. Our typical client is an R&D group looking for fast turn micro fabrication services fo
First Floor — The Challenge The design of Elevator Control Systems presents a unique mix of sophisticated computer control needs blended with industrial strength power switching requirements. Primary control signaling and contactor switching are per
Precision Logic provides components from every major manufacturer. A sampling of our current inventory includes. Agilent Altera AMP Amphenol Analog Device Advanced Micro Devices Alcoswitches Aromat Atmel AVX Bourns C & K switches Cornell
New Equipment | Component Programming
JTAG Technologies In-system Programming Tools. JTAG Technologies solutions for programming embedded memories of Microprocessors and DSPs are also known as SCIP (Serial Controlled IC Programmer) modules. The family comprises a wide range of software
Solutions for your Engineering challenges Phoenix Designs provides turn-key or task specific services for the hardware and firmware design of embedded micro controller based or discrete control systems. The design team has experience in "C" and asse
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
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