New Equipment | Solder Materials
Indium Corporation is a developer, manufacturer, and global supplier of: specialty solders (including solder paste, preforms, spheres, columns, wire, tubing, ribbon, and foil), fluxes, electrically-conductive adhesives, inorganic compounds (including
New Equipment | Assembly Services
Do you need rapid PCB prototyping with quick turnaround times? For the past 11 years, engineers, assemblers, and designers from around the world have counted on us for their quick turn PCBs. Companies big and small know that they can depend on us f
Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan
New Equipment | Rework & Repair Services
Complete BGA rework service. Remove - reball - replace - xray.
Ball Grid Array X-Ray Inspection Guide - 20 Colour Charts Includes X-Ray inspection guide of satisfactory BGA solder joints and process defects, x-ray images are black and white. The posters are provided as a pdf file and can be printed as A4 or A3
New Equipment | Rework & Repair Services
BGA and QFN removal, replacement & re-balling services ECO rework services – jumper wires, etch cuts, etc. Component and Memory Upgrades Trace and Pad repair Revision Updates Quick-turn ECO rework capabilities
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
Flexible, Scalable Solutions For Maximum Versatility. Advantis® sets a higher standard for midrange assembly solutions, offering unmatched performance and flexibility at a low entry price. Advantis delivers scalable capacity, easy-to-use operation,
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pit
Mid-level SMT Pick and Place system designed for customers who have a wide part mix with medium to higher production volumes. The Mx200 series of pick and place machines utilize next generation linear motor technology providing speed and placement
