New SMT Equipment: msl 2 bakeout (Page 1 of 1)

Baking

Baking

New Equipment |  

The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref

OX3 Corporation

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Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
High Throughput Reflow Oven

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Thermal Transfer Materials.