High-Mix, Medium Volume Automated Optical Inspection The Supra E is the class-leading, cost effective solution for all PCB manufacturers with PCBs up to 20” x 20”. MVP’s Quad-Color technology provides the ability to use multiple angles of light t
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
The largest format AOI solution for large board sizes or backplane inspection. The Spectra Series Tri-Color Technology system is MVP’s large format AOI solution. The Spectra has a standard handling size of 24 x 24 inches (610 x 610mm). The optional
The Ultra V is MVP’s fastest AOI system, designed for manufacturers with the need for the fastest beat rates. The Ultra V Series deploys the highest speed interfaces, computers and camera technologies to provide the fastest inspection times without
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
BI2-M12-AN6X-H1141 NI4-M12-AN6X-H1141 NI8-M18-AP6X-H1141 BI5-M18E-AP6X-H1141 BI10-M30-AN6X4M BI10-M30-AN6X5M BI10-M30-AN6X7M BI10-M30-AN6X／S903M BI10-M30-AN6X-H1141 BI10-M30-AP6X BI10-M30-AP6X5M NI15-M30-AP6X7M NI15-M30-AP6X／S90 NI4-M12-RD4X5M BI5-M
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